Sustainability

Scope

Drive and enable stakeholders in the electronics manufacturing value chain to meet organizational and societal sustainability goals in all parts of the electronics manufacturing value chain.

Drivers

Lack of cohesive approach to sustainability; need to address global restrictions and regulations, need to enable tools to support sustainability.

Related Projects

Alternative Materials Assessment - Completed

BiSn-Based Low-Temperature Soldering Process and Reliability, Phase 3b - In Progress

BiSn-Based Low-Temperature Soldering Process and Reliability, Phases 1-3a - Completed

BiSn-Based Low-Temperature Soldering Process and Reliability, Phases 1-3a - Completed

Characterization of Pb-Free Alloy Alternatives, Phase 1 - Completed

Characterization of Third Generation High-Reliability Pb-Free Alloys - In Progress

Counterfeit Components: Counterfeit Management & Best Practices - Completed

Counterfeit Components: Emerging Trends in Counterfeit Detection & Mitigation - Completed

Counterfeit Components: Size & Breadth of Counterfeiting Risks - Completed

Development of an Imaging AOI + AI Ecosystem - In Development

Eco Design for Circular Electronics Economy - Completed

Eco-Impact Estimator, Phase 3 - Completed

Eco-Impact Estimator, Phase 4 - In Development

Eco-Impact Evaluator for ICT Equipment Project, Phase 1 - Completed

Eco-Impact Evaluator for ICT Equipment, Phase 2 (LCA Estimator Tool Development) - Completed

Electronic Product Dataset Project - In Progress

Environmentally Sustainable Electronics TIG - Completed

Extended Reliability Assessment for Electronic Components - Completed

Extended Reliability Assessment for Electronic Components, Phase 2 - In Development

HFR-Free High-Reliability PCB - Completed

HFR-Free Leadership Program - Completed

HFR-Free PCB Material Evaluation Project - Completed

HFR-Free PCB Materials, Phase 2 - Completed

HFR-Free Signal Integrity, Phase 2 - Completed

INEMI LCA Estimator Discussion and Q&A Session (members only) - Completed

INEMI Tin Whiskers Projects - Completed

Lead-Free Assembly Project - Completed

Low Temperature Material Discovery and Characterization for First Level Interconnect - In Progress

Metals Recycling - Completed

Non-Physical Data Destruction for Enterprise Storage - Completed

Pb-Free Alloy Alternatives - Completed

Pb-Free BGAs in SnPb Assemblies Project - Completed

Pb-Free Component & Board Finish Reliability - Completed

Pb-Free Early Failure, Phase 2 - Completed

Pb-Free Nano-Solder Project - Completed

Pb-Free Rework Optimization Project - Completed

Pb-Free Rework Optimization, Phase 3 - Completed

PCB Immersion Cooling - In Development

Primary Factors in Component Warpage - Completed

PVC Alternatives - Completed

Rare Earth Metals Assessment & Supply Chain Actions - Completed

Repair and Recycling Metrics - Completed

Reuse and Recycling Metrics, Phase 2 - Completed

Test Strategy Project - Completed

Thermal Interface Material Performance Characterization Methodology, Phase 1 - In Development

Tin Whiskers Project, Phase II - Completed

Value Recovery from Used Electronics, Phase 1 - Completed

Value Recovery from Used Electronics, Phase 2 - Completed

Vertical Farming/Manufacturing - Completed

Wiring Density for Organic Packaging Substrates - Completed

Combination of Static Messages

Upcoming Events

Future of Electronics: Govern AI by Use: A Risk-Based Framework for Sustainability Teams

Sustainability

Scope

Drivers

Related Projects

Related Roadmap Topics